MCP16331

DS20005308B-page 4

 2014 Microchip Technology Inc.

EN Input Logic Low

—

—

0.4

V

EN Input Leakage Current

—

0.007

0.5

µA

Soft-Start Time

—

600

—

µs

EN Low-to-High,



Thermal Shutdown Die

Temperature

—

160

—

C

Note 3

Die Temperature Hysteresis

—

30

—

C

Note 3

TEMPERATURE SPECIFICATIONS

Electrical Specifications:

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Operating Junction Temperature Range

-40

—

+125

°C

Steady State

Storage Temperature Range

-65

—

+150

°C

Maximum Junction Temperature

—

—

+160

°C

Transient

Package Thermal Resistances

Thermal Resistance, 6L-SOT-23

—

190.5

—

°C/W

EIA/JESD51-3 Standard

Thermal Resistance, 8L-2x3 TDFN

—

52.5

—

°C/W

EIA/JESD51-3 Standard

DC CHARACTERISTICS (CONTINUED)

Electrical Characteristics:

Boldface

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Note

1:

The input voltage should be > output voltage + headroom voltage; higher load currents increase the input voltage

necessary for regulation. See characterization graphs for typical input to output operating voltage range.

2:

3:

Determined by characterization, not production tested.

4:

This is ensured by design.