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MCP2003B-E/MF 数据表(PDF) 17 Page - Microchip Technology |
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MCP2003B-E/MF 数据表(HTML) 17 Page - Microchip Technology |
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17 / 32 page ![]() 2015-2016 Microchip Technology Inc. DS20005463C-page 17 MCP2003B 3.0 PACKAGING INFORMATION 3.1 Package Marking Information 8-Lead SOIC (150 mil) Examples: Examples : 8-Lead DFN (2x3) Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e Examples : 8-Lead DFN (3x3) NNN NNN ADP 613 25 DAEC 1613 256 MCP2003B SN^^^1613 256 3 e Device Code MCP2003B-E/MC ADP MCP2003BT-E/MC ADP MCP2003B-H/MC ADR MCP2003BT-H/MC ADR Device Code MCP2003B-E/MF DAEC MCP2003BT-E/MF DAEC MCP2003B-H/MF DAEE MCP2003BT-H/MF DAEE |
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