MCP2003-ESLASHSN datasheet(16/34 Pages) MICROCHIP

部件名	MCP2003-E/SN

功能描述	LIN J2602 Transceiver

PDF	34 Pages

Scroll/Zoom	100%

制造商	MICROCHIP [Microchip Technology]

网页	http://www.microchip.com

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16 / 34 page

MCP2003/4/3A/4A

DS20002230F-page 16

 2010-2014 Microchip Technology Inc.

2.5

Thermal Specifications

Parameter

Symbol

Typ.

Max.

Units

Test Conditions

Recovery Temperature

RECOVERY

+140

—

C

Shutdown Temperature

SHUTDOWN

+150

—

C

Short Circuit Recovery Time

tTHERM

1.5

5.0

Thermal Package Resistances

Thermal Resistance, 8L-DFN

JA

35.7

—

C/W

Thermal Resistance, 8L-PDIP

JA

89.3

—

C/W

Thermal Resistance, 8L-SOIC

JA

149.5

—

C/W

Note 1:

The maximum power dissipation is a function of TJMAX,

JA and ambient temperature TA. The maximum

allowable power dissipation at an ambient temperature is PD = (TJMAX - TA)

JA. If this dissipation is

exceeded, the die temperature will rise above 150

C and the device will go into thermal shutdown.

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