MCP1406/07

DS20002019C-page 6

 2006-2016 Microchip Technology Inc.

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Specified Temperature Range

-40

—

+125

°C

Maximum Junction Temperature

—

—

+150

°C

Storage Temperature Range

-65

—

+150

°C

Package Thermal Resistances

Junction-to-Ambient Thermal Resistance,

8-L 6x5 DFN

—31.8

—

Junction-to-Ambient Thermal Resistance, 8-L PDIP

—65.2

—

Junction-to-Ambient Thermal Resistance, 8-L SOIC

—96.3

—

Junction-to-Ambient Thermal Resistance,

5-L TO-220

—20.1

—

Junction-to-Case (Bottom) Thermal Resistance,

5-L TO-220

3.2

—

Junction-to-Top Characterization Parameter,

8-L 6x5 DFN

0.2

—

Junction-to-Top Characterization Parameter,

8-L PDIP

8.8

—

Junction-to-Top Characterization Parameter,

8-L SOIC

3.2

—

Junction-to-Top Characterization Parameter,

5-L TO-220

3.6

—

Junction-to-Board Characterization Parameter,

8-L 6x5 DFN

15.5

—

Junction-to-Board Characterization Parameter,

8-L PDIP

36.1

—

Junction-to-Board Characterization Parameter,

8-L SOIC

60.7

—

Junction-to-Board Characterization Parameter,

5-L TO-220

4.0

—

Note 1: Parameter is determined using a High 2S2P 4-layer board, as described in JESD 51-7, as well as in JESD

51-5, for packages with exposed pads.

2: Parameter is determined using a 1S0P 2-layer board with a cold plate attached to indicated location.