NCP694

http://onsemi.com

16

PACKAGE DIMENSIONS

SOT−89, 5 LEAD

CASE 528AB−01

ISSUE O

MOUNTING FOOTPRINT*

RECOMMENDED

C

0.10

TOP VIEW

SIDE VIEW

BOTTOM VIEW

C

H

1

DIM

MIN

MAX

MILLIMETERS

A

1.40

1.60

b1

0.37

0.57

b

0.32

0.52

c

0.30

0.50

D

4.40

4.60

D2

1.40

1.80

E

2.40

2.60

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. LEAD THICKNESS INCLUDES LEAD FINISH.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS.

5. DIMENSIONS L, L2, L3, L4, L5, AND H ARE MEAS-

URED AT DATUM PLANE C.

e

1.40

1.60

L

1.10

1.50

H

4.25

4.45

L2

0.80

1.20

L3

0.95

1.35

L4

0.65

1.05

L5

0.20

0.60

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

D

E

A

c

23

54

L

L5

e

e

b

b1

L2

D2

L4

L3

2X

0.62

DIMENSIONS: MILLIMETERS

1

2X

1.50

1.30

2.79

0.45

1.50

1.65

4.65

4X

0.57

1.75

1