BAS16HT1

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3

PACKAGE DIMENSIONS

SOD−323

CASE 477−02

ISSUE D

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. LEAD THICKNESS SPECIFIED PER L/F

DRAWING WITH SOLDER PLATING.

4. DIMENSIONS A AND B DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS OR GATE

BURRS.

5. DIMENSION L IS MEASURED FROM END OF

RADIUS.

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

1.60

1.80

0.063

0.071

B

1.15

1.35

0.045

0.053

C

0.80

1.00

0.031

0.039

D

0.25

0.40

0.010

0.016

E

0.15 REF

0.006 REF

H

0.00

0.10

0.000

0.004

J

0.089

0.177

0.0035

0.0070

K

2.30

2.70

0.091

0.106

NOTE 3

A

K

1

2

D

B

E

H

C

J

STYLE 1:

PIN 1. CATHODE

2. ANODE

L

0.075

−−−

0.003

−−−

NOTE 5

L

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

1.60

0.063

0.63

0.025

0.83

0.033

2.85

0.112