BAT20J

4/5

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

I(A)

FM

T =25°C

j

T =85°C

j

T =150°C

j

V(V)

FM

Fig. 7-1: Forward voltage drop versus forward

current (typical values, high level).

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

I(A)

FM

T =85°C

(typical values)

j

T =25°C

(maximum values)

j

T =150°C

(typical values)

j

T =25°C

(typical values)

j

V(V)

FM

Fig. 7-2: Forward voltage drop versus forward

current (low level).

0

50

100

150

200

250

300

350

400

450

500

550

600

0

5

10

15

20

25

30

35

40

45

50

R(°C/W)

th(j-a)

S(mm

Cu

²)

Fig. 8: Thermal resistance junction to ambient

versus copper surface under tab (epoxy

values).

0

50

100

150

200

250

300

350

400

450

500

550

600

650

700

0

50

100

150

200

250

300

350

400

R

(°C/W)

th(j-a)

P(mW

)

S

=2.25mm

CU

2

T

=25°C

amb

Fig. 9: Thermal resistance junction to ambient

versus power dissipation (epoxy printed circuit