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PACKAGE OUTLINE

C

SEE TERMINAL

DETAIL

24X

0.30

0.18

2.8 0.1

24X

0.5

0.3

1 MAX

(0.2) TYP

0.05

0.00

20X 0.5

2X

2.5

2X 2.5

A

4.1

3.9

B

4.1

3.9

0.30

0.18

0.5

0.3

4222437/A 12/2015

VQFN - 1 mm max height

RGE0024F

PLASTIC QUAD FLATPACK - NO LEAD

PIN 1 INDEX AREA

0.08

SEATING PLANE

1

6

13

18

7

12

24

19

(OPTIONAL)

PIN 1 ID

0.1

C A

B

0.05

EXPOSED

THERMAL PAD

25

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

4. Reference JEDEC registration MO-220.

SCALE 3.300

DETAIL

OPTIONAL TERMINAL

TYPICAL

16

TUSB522P

SLLSEV9A – JULY 2016 – REVISED OCTOBER 2016

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Product Folder Links: TUSB522P

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