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EXAMPLE BOARD LAYOUT

0.05 MIN

ALL AROUND

0.05 MAX

ALL AROUND

24X (0.24)

24X (0.6)

(

) TYP

VIA

0.2

20X (0.5)

(3.8)

(3.8)

(1.15)

TYP

(

2.8)

(R

)

ALL PAD CORNERS

0.05

4222437/A 12/2015

SYMM

VQFN - 1 mm max height

RGE0024F

PLASTIC QUAD FLATPACK - NO LEAD

1

6

7

12

13

18

19

24

SYMM

LAND PATTERN EXAMPLE

SCALE:18X

25

NOTES: (continued)

5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

6. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations

are shown.

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

SOLDER MASK DETAILS

DEFINED

(PREFERRED)

17

TUSB522P

www.ti.com

SLLSEV9A – JULY 2016 – REVISED OCTOBER 2016

Product Folder Links: TUSB522P

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