TC72-2.8MMF datasheet(9/28 Pages) MICROCHIP

9 / 28 page

DS21743B-page 9

TC72

3.0

PIN DESCRIPTION

Pin functionalities are described in Table 3-1.

3.1

No Connection (NC)

This pin is not internally connected to the die.

3.2

Serial Clock Input (SCK)

The SCK pin is an Input pin. All communication and

timing is relative to the signal on this pin. The clock is

generated by the host controller on the SPI bus (see

Section 4.3 “Serial Bus Interface”).

3.3

Chip Enable Input (CE)

The CE is a Chip Enable pin. This is an active high

input, therefore the device is enabled when CE is

toggled to VDD. Once the device is enabled, all serial

communication begins (see Section 4.3 “Serial Bus

Interface”).

3.4

Ground (GND)

The GND is the system Ground pin.

3.5

Serial Data Input (SDI)

The SDI is a Data Input pin, used to transmit data from

the host to the device (see Section 4.3 “Serial Bus

Interface”).

3.6

Serial Data Output (SDO)

The SDO is a Data Output pin, used to transmit data

from the device to the host (see Section 4.3 “Serial

Bus Interface”).

3.7

Power Supply (VDD)

VDD is the Power pin. The operating voltage range, as

specified in the DC electrical specification table, is

applied on this pin.

3.8

Exposed Pad (EP)

There is an internal electrical connection between the

Exposed Thermal Pad (EP) and the GND pin; they can

be connected to the same potential on the Printed

Circuit Board (PCB). This provides better thermal

conduction from the PCB to the die.

TABLE 3-1:

PIN FUNCTION TABLE

TC72

Symbol

Function

3x3 DFN

MSOP

No internal connection

SCK

Serial Clock input

Chip Enable input, the device is selected when this input is high

GND

Ground

SDI

Serial Data input

SDO

Serial Data output

No internal connection

VDD

Power supply

—

Exposed pad (Ground)

TC72-2.8MMF 数据表(PDF) 9 Page - Microchip Technology

TC72-2.8MMF 数据表(HTML) 9 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28

数据表下载