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TLV6001UIDBVT 数据表(PDF) 20 Page - Texas Instruments

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部件名 TLV6001UIDBVT
功能描述  Low-Power, Rail-to-Rail In/Out, 1-MHz Operational Amplifier for Cost-Sensitive Systems
PDF  37 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

TLV6001UIDBVT 数据表(HTML) 20 Page - Texas Instruments

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VIN
VOUT
RG
RF
±IN
+IN
V±
VS+
GND
VS±
GND
VOUT
VIN
Run the input traces
as far away from
the supply lines
as possible.
Use a low-ESR,
ceramic bypass
capacitor.
RF
RG
Place components
close to the device
and to each other to
reduce parasitic
errors.
Use a low-ESR,
ceramic bypass
capacitor.
OUT
V+
Copyright © 2016, Texas Instruments Incorporated
20
TLV6001, TLV6002, TLV6004
SBOS779B – JUNE 2016 – REVISED OCTOBER 2016
www.ti.com
Product Folder Links: TLV6001 TLV6002 TLV6004
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
11 Layout
11.1 Layout Guidelines
For best operational performance of the device, use good printed circuit board (PCB) layout practices, including:
•
Noise may propagate into analog circuitry through the power pins of the circuit and the operational
amplifier. Use bypass capacitors to reduce the coupled noise by providing low-impedance power sources
local to the analog circuitry.
–
Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-
supply applications.
•
Separate grounding for analog and digital portions of the circuitry is one of the simplest and most
effective methods of noise suppression. One or more layers on multilayer PCBs are typically devoted to
ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Take care to
physically separate digital and analog grounds, paying attention to the flow of the ground current. For
more detailed information, refer to Circuit Board Layout Techniques (SLOA089).
•
To reduce parasitic coupling, run the input traces as far away from the supply or output traces as
possible. If the traces cannot be kept separate, crossing the sensitive trace perpendicularly is much better
than crossing in parallel with the noisy trace.
•
Place the external components as close to the device as possible. Keep RF and RG close to the inverting
input in order to minimize parasitic capacitance, as shown in Figure 25.
•
Keep the length of input traces as short as possible. Remember that the input traces are the most
sensitive part of the circuit.
•
Consider a driven, low-impedance guard ring around the critical traces. A guard ring may significantly
reduce leakage currents from nearby traces that are at different potentials.
11.2 Layout Example
Figure 25. Operational Amplifier Board Layout for Noninverting Configuration
Figure 26. Schematic Representation of Figure 25



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