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TLV6001, TLV6002, TLV6004

SBOS779B – JUNE 2016 – REVISED OCTOBER 2016

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Product Folder Links: TLV6001 TLV6002 TLV6004

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Copyright © 2016, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

7.4 Thermal Information: TLV6001

TLV6001

UNIT

DBV (SOT-23)

DCK (SC70)

5 PINS

5 PINS

Junction-to-ambient thermal resistance

228.5

281.4

°C/W

Junction-to-case (top) thermal resistance

99.1

91.6

°C/W

Junction-to-board thermal resistance

54.6

59.6

°C/W

Junction-to-top characterization parameter

7.7

1.5

°C/W

Junction-to-board characterization parameter

53.8

58.8

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

7.5 Thermal Information: TLV6002

TLV6002

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

138.4

191.2

°C/W

Junction-to-case (top) thermal resistance

89.5

61.9

°C/W

Junction-to-board thermal resistance

78.6

111.9

°C/W

Junction-to-top characterization parameter

29.9

5.1

°C/W

Junction-to-board characterization parameter

78.1

110.2

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

7.6 Thermal Information: TLV6004

TLV6004

UNIT

PW (TSSOP)

14 PINS

Junction-to-ambient thermal resistance

121.0

°C/W

Junction-to-case (top) thermal resistance

49.4

°C/W

Junction-to-board thermal resistance

62.8

°C/W

Junction-to-top characterization parameter

5.9

°C/W

Junction-to-board characterization parameter

62.2

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W