L6712A L6712

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(*) Pin not reported in QFN column have to be considered as Not Connected, not internally bonded.

16

16

ISEN2

Channel 2 current sense pin. The output current may be sensed across a sense

low-side mosfet drain or to the sense resistor through a resistor Rg.

The net connecting the pin to the sense point must be routed as close as

possible to the PGNDS net in order to couple in common mode any picked-up

noise.

17

18

OSC/INH

FAULT

Oscillator pin.

It allows programming the switching frequency of each channel: the equivalent

switching frequency at the load side results in being doubled.

Internally fixed at 1.24V, the frequency is varied proportionally to the current sunk

(forced) from (into) the pin with an internal gain of 6kHz/

µA (See relevant section

for details). If the pin is not connected, the switching frequency is 150kHz for

each channel (300kHz on the load).

The pin is forced high (5V Typ.) when an Over Voltage is detected; to recover

from this condition, cycle VCC.

Forcing the pin to a voltage lower than 0.6V, the device stops operation and

enters the inhibit state.

18

20

FBG

Remote sense amplifier inverting input. It has to be connected to the negative

side of the load to perform programmable remote sensing through apposite

resistors (see relative section).

19

21

FBR

Remote sense amplifier non-inverting input. It has to be connected to the positive

side of the load to perform programmable remote sensing through apposite

resistors (see relative section).

20 to 22

22 to 24

VID0-2

Voltage IDentification pins. These input are internally pulled-up. They are used to

program the output voltage as specified in Table 1 and to set the PGOOD, OVP

and UVP thresholds.

Connect to GND to program a ‘0’ while leave floating to program a ‘1’.

23

25

PGOOD

This pin is an open collector output and is pulled low if the output voltage is not

within the above specified thresholds and during soft-start.

It cannot be pulled up above 5V. If not used may be left floating.

24

27

BOOT2

Channel 2 HS driver supply. This pin supplies the relative high side driver.

Connect through a capacitor (100nF typ.) to the PHASE2 pin and through a diode

to VCC (cathode vs. boot).

25

28

UGATE2

Channel 2 HS driver output.

A little series resistor helps in reducing device-dissipated power.

26

29

PHASE2

Channel 2 HS driver return path. It must be connected to the HS2 mosfet source

and provides the return path for the HS driver of channel 2.

27

30

LGATE2

Channel 2 LS driver output.

A little series resistor helps in reducing device-dissipated power.

28

31,

32

PGND

LS drivers return path.

This pin is common to both sections and it must be connected through the

closest path to the LS mosfets source pins in order to reduce the noise injection

into the device.

PAD

THERMAL

PAD

Thermal pad connects the silicon substrate and makes a good thermal contact

with the PCB to dissipate the power necessary to drive the external

mosfets.Connect to the GND plane with several vias to improve thermal

conductivity.

PIN FUNCTION (continued)

N. (*)

Name

Description

SO

VFQFPN