ADP1761ACPZ-R7 datasheet(17/19 Pages) AD

17 / 19 page

ADP1761

Data Sheet

Rev. 0 | Page 16 of 18

In cases where the board temperature is known, the thermal

characterization parameter (ΨJB) can be used to estimate the

junction temperature rise. The maximum junction temperature

(TJ) is calculated from the board temperature (TB) and power

dissipation (PD) using the following formula:

TJ = TB + (PD × ΨJB)

(7)

Figure 40 through Figure 43 show the junction temperature

calculations for the different board temperatures, load currents,

VIN to VOUT differentials, and areas of PCB copper.

VIN – VOUT (V)

100

120

140

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

10mA

100mA

500mA

TJ MAX

Figure 40. 500 mm2 of PCB Copper, TB = 25°C

100

120

140

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

10mA

100mA

500mA

TJ MAX

VIN – VOUT (V)

Figure 41. 500 mm2 of PCB Copper, TB = 50°C

VIN – VOUT (V)

100

120

140

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

10mA

100mA

500mA

TJ MAX

Figure 42. 1000 mm2 of PCB Copper, TB = 25°C

VIN – VOUT (V)

100

120

140

0.20.4

0.6

0.81.01.2

1.41.6

10mA

100mA

500mA

TJ MAX

Figure 43. 1000 mm2 of PCB Copper, TB = 50°C

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