ADP7157ARDZ-03-R7 datasheet(6/24 Pages) AD

6 / 24 page

Data Sheet

ADP7157

Rev. A | Page 5 of 23

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

VIN to Ground

−0.3 V to +7 V

VREG to Ground

−0.3 V to VIN or +4 V

(whichever is less)

VOUT to Ground

−0.3 V to VREG or +4 V

(whichever is less)

VOUT_SENSE to Ground

−0.3 V to VREG or +4 V

(whichever is less)

VOUT to VOUT_SENSE

±0.3 V

BYP to VOUT

±0.3 V

EN to Ground

−0.3 V to +7 V

BYP to Ground

−0.3 V to VREG or +4 V

(whichever is less)

REF to Ground

−0.3 V to VREG or +4 V

(whichever is less)

REF_SENSE to Ground

−0.3 V to +4 V

Storage Temperature Range

−65°C to +150°C

Operational Junction Temperature

Range

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination. The ADP7157 can be damaged when the junction

temperature limits are exceeded. Monitoring ambient temperature

does not guarantee that TJ is within the specified temperature

limits. In applications with high power dissipation and poor

thermal resistance, the maximum ambient temperature may

need to be derated.

In applications with moderate power dissipation and low

printed circuit board (PCB) thermal resistance, the maximum

ambient temperature can exceed the maximum limit as long as

the junction temperature is within specification limits. The

junction temperature (TJ) of the device is dependent on the

ambient temperature (TA), the power dissipation of the device

(PD), and the junction to ambient thermal resistance of the

package (θJA).

The maximum TJ is calculated from the TA and the PD using the

following formula:

TJ = TA + (PD × θJA)

The junction to ambient thermal resistance (θJA) of the package

is based on modeling and calculation using a 4-layer board. The

junction to ambient thermal resistance is highly dependent on

the application and board layout. In applications where high

maximum power dissipation exists, close attention to thermal

board design is required. The θJA value may vary, depending on

PCB material, layout, and environmental conditions. The specified

θJA values are based on a 4-layer, 4 in. × 3 in. circuit board. See

the JESD51-7 standard and the JESD51-9 standard for detailed

information on the board construction.

ΨJB is the junction to board thermal characterization parameter

with units of °C/W. ΨJB of the package is based on modeling and

calculation using a 4-layer board. JESD51-12, Guidelines for

Reporting and Using Electronic Package Thermal Information,

states that thermal characterization parameters are not the same

as thermal resistances. ΨJB measures the component power

flowing through multiple thermal paths rather than a single

path as in thermal resistance, θJB. Therefore, ΨJB thermal paths

include convection from the top of the package as well as

radiation from the package, factors that make ΨJB more useful

in real-world applications. Use the board temperature (TB) and

power dissipation (PD) to calculate the maximum junction

temperature (TJ) by

TJ = TB + (PD × ΨJB)

See the JESD51-8 standard and the JESD51-12 standard for

more detailed information about ΨJB.

THERMAL RESISTANCE

θJA, θJC, and ΨJB are specified for the worst case conditions, that

is, a device soldered in a circuit board for surface-mount

packages.

Table 5. Thermal Resistance

Package Type

Unit

10-Lead LFCSP

53.8

15.6

29.1

°C/W

8-Lead SOIC

50.4

42.3

30.1

°C/W

ESD CAUTION

ADP7157ARDZ-03-R7 数据表(PDF) 6 Page - Analog Devices

ADP7157ARDZ-03-R7 数据表(HTML) 6 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

数据表下载

链接网址

ADP7157ARDZ-03-R7 数据表(PDF) 6 Page - Analog Devices

ADP7157ARDZ-03-R7 数据表(HTML) 6 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

数据表 下载

链接网址

数据表下载