CAT93C57PI datasheet(2/9 Pages) CATALYST

2 / 9 page

CAT93C56/57

Doc. No. 1088, Rev. M

D.C. OPERATING CHARACTERISTICS

VCC = +1.8V to +6.0V, unless otherwise specified.

SymbolParameter

Test Conditions

Min

Typ

Max

Units

ICC1

Power Supply Current

fSK = 1MHz

(Write)

VCC = 5.0V

ICC2

Power Supply Current

fSK = 1MHz

500

µA

(Read)

VCC = 5.0V

ISB1

Power Supply Current

CS = 0V

µA

(Standby) (x8 Mode)

ORG=GND

ISB2

Power Supply Current

CS=0V

µA

(Standby) (x16Mode)

ORG=Float or VCC

ILI

Input Leakage Current

VIN = 0V to VCC

µA

ILO

Output Leakage Current

VOUT = 0V to VCC,1

µA

(Including ORG pin)

CS = 0V

VIL1

Input Low Voltage

4.5V

≤ VCC < 5.5V

-0.1

0.8

VIH1

Input High Voltage

4.5V

≤ VCC < 5.5V

VCC + 1

VIL2

Input Low Voltage

1.8V

≤ VCC < 4.5V

VCC x 0.2

VIH2

Input High Voltage

1.8V

≤ VCC < 4.5V

VCC x 0.7

VCC+1

VOL1

Output Low Voltage

4.5V

≤ VCC < 5.5V

0.4

IOL = 2.1mA

VOH1

Output High Voltage

4.5V

≤ VCC < 5.5V

2.4

IOH = -400

µA

VOL2

Output Low Voltage

1.8V

≤ VCC < 4.5V

0.2

IOL = 1mA

VOH2

Output High Voltage

1.8V

≤ VCC < 4.5V

VCC - 0.2

IOH = -100

µA

ABSOLUTE MAXIMUM RATINGS*

Temperature Under Bias .................. -55

°C to +125°C

Storage Temperature ........................ -65

°C to +150°C

Voltage on any Pin with

Respect to Ground(1) ............. -2.0V to +VCC +2.0V

VCC with Respect to Ground ................ -2.0V to +7.0V

Package Power Dissipation

Capability (TA = 25

°C) ................................... 1.0W

Lead Soldering Temperature (10 secs) ............ 300

°C

Output Short Circuit Current(2) ........................ 100 mA

*COMMENT

Stresses above those listed under “Absolute Maximum

Ratings” may cause permanent damage to the device.

These are stress ratings only, and functional operation of

the device at these or any other conditions outside of those

listed in the operational sections of this specification is not

implied. Exposure to any absolute maximum rating for

extended periods may affect device performance and

reliability.

RELIABILITY CHARACTERISTICS

SymbolParameter

Reference Test Method

Min

Typ

Max

Units

NEND(3)

Endurance

MIL-STD-883, Test Method 1033

1,000,000

Cycles/Byte

TDR(3)

Data Retention

MIL-STD-883, Test Method 1008

100

Years

VZAP(3)

ESD Susceptibility

MIL-STD-883, Test Method 3015

2000

Volts

ILTH(3)(4)

Latch-Up

JEDEC Standard 17

100

Note:

(1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC

voltage on output pins is VCC +0.5V, which may overshoot to VCC +2.0V for periods of less than 20 ns.

(2) Output shorted for no more than one second. No more than one output shorted at a time.

(3) This parameter is tested initially and after a design or process change that affects the parameter.

(4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V.

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