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LM2702 数据表(PDF) 19 Page - National Semiconductor (TI) |
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LM2702 数据表(HTML) 19 Page - National Semiconductor (TI) |
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19 / 21 page ![]() Operation (Continued) Vcom AND Gamma COMPENSATION The architecture used for the amplifiers in the LM2702 re- quires external compensation on the output. Depending on the equivalent capacitive load of the TFT-LCD panel, exter- nal components at the amplifier outputs may or may not be necessary. If the capacitance presented by the load is equal to or greater than 5nF no external components are needed as the TFT-LCD panel will act as compensation itself. Dis- tributed resistive and capacitive loads enhance stability and increase performance of the amplifiers. If the capacitance presented by the load is less than 5nF external components will be required as the load itself will not ensure stability. No external compensation in this case will lead to oscillation of the amplifier and an increase in power consumption. A single 5nF or greater capacitor on the output will ensure a stable amplifier with no oscillations. For applications requiring a higher slew rate, a good choice for compensation is to add a 50 Ω (R COM or RGAMMA) in series with a 1nF (CCOM or C GAMMA) capacitor from the output of the amplifier to ground. This allows for driving zero to infinite capacitance loads with no oscillations, minimal overshoot, and a higher slew rate than using a large capacitor. The high phase margin created by the external compensation will guarantee stability and good performance for all conditions. For noise sensitive applications greater output capacitance may be desired. When the power supply for the amplifiers (AV IN) is connected to the output of the switching regulator, the output ripple of the regulator will produce ripple at the output of the amplifiers. LAYOUT CONSIDERATIONS The LM2702 uses a single ground connection, GND. The feedback, softstart, delay, and compensation networks should be connected directly to a dedicated analog ground plane and this ground plane must connect to the GND pin, as shown in Figure 3. If no analog ground plane is available then the ground connections of the feedback, softstart, de- lay, and compensation networks must tie directly to the GND pin, as show in Figure 4. Connecting these networks to the PGND plane can inject noise into the system and effect performance. The input bypass capacitor C IN must be placed close to the IC. This will reduce copper trace resistance which effects input voltage ripple of the IC. For additional input voltage filtering, a 100nF bypass capacitor can be placed in parallel with C IN, close to the VIN pin, to shunt any high frequency noise to ground. The output capacitor, C OUT, should also be placed close to the IC. Any copper trace connections for the C OUT capacitor can increase the series resistance, which directly effects output voltage ripple and efficiency. The feed- back network, resistors R1 and R2, should be kept close to the FB pin, and away from the inductor, to minimize copper trace connections that can inject noise into the system. Trace connections made to the inductor and schottky diode should be minimized to reduce power dissipation and in- crease overall efficiency. 20051152 FIGURE 3. Multi-Layer Layout www.national.com 19 |
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