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STM8AL3166 数据表(PDF) 115 Page - STMicroelectronics |
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STM8AL3166 数据表(HTML) 115 Page - STMicroelectronics |
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115 / 124 page ![]() DocID18474 Rev 7 115/124 STM8AL313x/4x/6x STM8AL3L4x/6x Package information 123 10.4 VFQFPN32 package information Figure 47. VFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch very thin profile fine pitch quad flat package outline 1. Drawing is not to scale. 2. There is an exposed die pad on the underside of the VQFPN package. It is recommended to connect and solder this backside pad to the PCB ground. |
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