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STM32F303RE 数据表(PDF) 157 Page - STMicroelectronics |
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STM32F303RE 数据表(HTML) 157 Page - STMicroelectronics |
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157 / 173 page  DocID026415 Rev 5 157/173 STM32F303xD STM32F303xE Package information 171 Figure 58. Recommended footprint for the UFBGA100 package Note: Non-solder mask defined (NSMD) pads are recommended. Note: 4 to 6 mils solder paste screen printing process. ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 94. UFBGA100 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.27 mm Dsm 0.35 mm typ. (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter. Table 93. UFBGA100 package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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