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STM32F303RE 数据表(PDF) 163 Page - STMicroelectronics |
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STM32F303RE 数据表(HTML) 163 Page - STMicroelectronics |
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163 / 173 page  DocID026415 Rev 5 163/173 STM32F303xD STM32F303xE Package information 171 Figure 64. Recommended footprint for the WLCSP100 package Table 96. WLCSP100 package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Typ Min Max A 0.525 0.555 0.585 0.0207 0.0219 0.0230 A1 - 0.175 - - 0.0069 - A2 - 0.38 - - 0.0150 - A3(2) 2. Back side coating. - 0.025 - - 0.0010 - Ø b(3) 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 0.22 0.25 0.28 - 0.0098 0.0110 D 4.74 4.775 4.81 - 0.1880 0.1894 E 5.006 5.041 5.076 - 0.1985 0.1998 e - 0.4 - - 0.0157 - e1 - 3.6 - - 0.1417 - e2 - 3.6 - - 0.1417 - F - 0.5875 - - 0.0231 - G - 0.7205 - - 0.0284 - N - 100 - - 3.9370 - aaa - 0.1 - - 0.0039 - bbb - 0.1 - - 0.0039 - ccc - 0.1 - - 0.0039 - ddd - 0.05 - - 0.0020 - eee - 0.05 - - 0.0020 - |
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