HCPL4100 datasheet(4/12 Pages) HP

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Regulatory Information

The HCPL-4100 has been

approved by the following

organizations:

Recognized under UL 1577,

Component Recognition

Program, File E55361.

CSA

Approved under CSA Component

Acceptance Notice #5, File CA

88324.

Insulation and Safety Related Specifications

Parameter

Symbol

Value

Units

Conditions

Min. External Air Gap

L(IO1)

7.1

Measured from input terminals to output

(External Clearance)

terminals, shortest distance through air

Min. External Tracking Path

L(IO2)

7.4

Measured from input terminals to output

(External Creepage)

terminals, shortest distance path along body

Min. Internal Plastic Gap

0.08

Through insulation distance, conductor to

(Internal Clearance)

conductor, usually the direct distance

between the photoemitter and photodetector

inside the optocoupler cavity

Tracking Resistance

CTI

200

Volts

DIN IEC 112/VDE 0303 PART 1

(Comparative Tracking Index)

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

Option 300 – surface mount classification is Class A in accordance with CECC 00802.

Absolute Maximum Ratings

(No Derating Required up to 55

°C)

Storage Temperature .................................................. -55

°C to +125°C

Operating Temperature ................................................. -40

°C to +85°C

Lead Solder Temperature .... 260

°C for 10 s (1.6 mm below seating plane)

Supply Voltage – VCC .............................................................. 0 V to 20 V

Average Output Current - IO ........................................ -30 mA to 30 mA

Peak Output Current - IO ........................................... Internally Limited

Output Voltage – VO ........................................................ -0.4 V to 27 V

Input Voltage – VI ............................................................ -0.5 V to 20 V

Input Power Dissipation – PI ................................................. 265 mW[1]

Output Power Dissipation – PO ............................................. 125 mW[2]

Total Power Dissipation – P .................................................. 360 mW[3]

Infrared and Vapor Phase Reflow Temperature

(Option #300) .......................................... see Fig. 1, Thermal Profile

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