IS1870SF datasheet(1/44 Pages) MICROCHIP

部件名	IS1870SF

功能描述	Bluetooth짰 Low Energy (BLE) SoC

PDF	44 Pages

Scroll/Zoom	100%

制造商	MICROCHIP [Microchip Technology]

网页	http://www.microchip.com

标志

1 / 44 page

 2015-2016 Microchip Technology Inc.

DS60001371C-Page 1

IS1870/71

Features

• Bluetooth smart 4.2 Bluetooth Low-Energy (BLE)

compliant

• 256 Kbytes embedded Flash memory

• UART/SPI/I2C interface supported

• Integrated crystal oscillator, operates with 32 MHz

external crystal

• Temperature sensor supported

• Flexible GPIO pins:

- 31 GPIO pins (IS1870)

- 15 GPIO pins (IS1871)

• PWM support:

- 4-channel PWM support (IS1870)

- 1-channel PWM support (IS1871)

• 12 bits ADC (ENOB=10/8-bit) support for battery

and voltage detection. 16-channel (IS1870)/

6-channel (IS1871)

• AES-CMAC hardware engine

• Beacon support

• Low-power consumption

• Peak current: Tx 13 mA, Rx 13 mA at VBAT=3.0V,

buck power

• Compact size:

- IS1871: 4 mm x 4 mm 32QFN package

- IS1870: 6 mm x 6 mm 48QFN package

Radio Frequency (RF)/Analog Features

• ISM band: 2.402 GHz to 2.480 GHz operation

• Channels: 0-39

• Rx sensitivity: -90 dBm in BLE mode

• Tx power: +2 dBm (max)

• Received Signal Strength Indicator (RSSI) moni-

tor

Operating Conditions

• Operating voltage: 1.9V to 3.6V

• Operating temperature: -20°C to +70°C

Applications

• Internet of Things (IoT)

• Wearable, fitness, or healthcare

• Weight scale

• Proximity/Find Me services

• Payment/Security

• Digital Beacons

• Consumer appliances or home automation

• Industrial

Packages

Type

IS1870

IS1871

Pin Count

48

32

I/O Pins (up to)

31

16

Contact/Lead Pitch

0.4

Dimensions

6x6x0.9

4x4x0.9

Package

QFN48

QFN32

Note:

All dimensions are in millimeters (mm) unless specified.

Bluetooth® Low Energy (BLE) SoC

IS1870SF_IS1871SF.book Page 1 Thursday, March 31, 2016 10:29 AM

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