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LM45 数据表(PDF) 4 Page - National Semiconductor (TI) |
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LM45 数据表(HTML) 4 Page - National Semiconductor (TI) |
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4 / 9 page ![]() Typical Performance Characteristics To generate these curves the LM45 was mounted to a printed circuit board as shown in Figure 3. (Continued) Applications The LM45 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or ce- mented to a surface and its temperature will be within about 0.2˚C of the surface temperature. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the ac- tual temperature of the LM45 die would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity the backside of the LM45 die is directly attached to the GND pin. The lands and traces to the LM45 will, of course, be part of the printed cir- cuit board, which is the object whose temperature is being measured. These printed circuit board lands and traces will not cause the LM45s temperature to deviate from the de- sired temperature. Alternatively, the LM45 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM45 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where conden- sation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to in- sure that moisture cannot corrode the LM45 or its connec- tions. Temperature Rise of LM45 Due to Self-Heating (Thermal Resistance) SOT-23 SOT-23 no heat sink* small heat fin** Still air 450˚C/W 260˚C/W Moving air 180˚C/W * Part soldered to 30 gauge wire. ** Heat sink used is 1⁄2” square printed circuit board with 2 oz. foil with part at- tached as shown in Figure 3. Supply Voltage vs Supply Current DS011754-33 Start-Up Response DS011754-34 DS011754-23 FIGURE 3. Printed Circuit Board Used for Heat Sink to Generate All Curves. 1 ⁄2" Square Printed Circuit Board with 2 oz. Foil or Similar www.national.com 4 |
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