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MHV507-19-R 数据表(PDF) 2 Page - M/A-COM Technology Solutions, Inc.

部件名 MHV507-19-R
功能描述  Silicon Hyperabrupt Varactor Diode
PDF  4 Pages
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制造商  MA-COM [M/A-COM Technology Solutions, Inc.]
网页  http://www.macomtech.com
标志 MA-COM - M/A-COM Technology Solutions, Inc.

MHV507-19-R 数据表(HTML) 2 Page - M/A-COM Technology Solutions, Inc.

  MHV507-19-R Datasheet HTML 1Page - M/A-COM Technology Solutions, Inc. MHV507-19-R Datasheet HTML 2Page - M/A-COM Technology Solutions, Inc. MHV507-19-R Datasheet HTML 3Page - M/A-COM Technology Solutions, Inc. MHV507-19-R Datasheet HTML 4Page - M/A-COM Technology Solutions, Inc.  
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M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
2
Silicon Hyperabrupt Varactor Diode
Rev. V1
MHV507-19-1
Environmental Capabilities
The MHV507-19-1 silicon hyperabrupt junction
varactor diode is durable and capable of reliably
operating in military, commercial, and industrial
environments. The device is compatible with
pick-and-place assembly and is available in tape
and reel. The MHV507-19-1 silicon hyperabrupt
junction varactor diode is capable of meeting the
environmental requirements of MIL-STD-750.
ESD & Moisture Sensitivity Level Rating
As are all semiconductors, silicon hyperabrupt
tuning varactor diode are susceptible to damage
from
ESD
events.
Proper
ESD
prevention
procedures should be followed. The ESD rating for
this device is Class 0 (HBM). The moisture
sensitivity level (MSL) rating for this part is MSL 1.
Assembly Instructions
Diodes may be placed onto circuit boards with pick and place manufacturing equipment from tape-reel. The
devices are attached to the circuit using conventional solder re-flow or wave soldering procedures with RoHS type
or Sn 60 / Pb 40 type solders.
Table 1. Time-Temperature Profile for Sn60/Pb40 or RoHS Type Solders
Profile Feature
SnPb Solder Assembly
Pb-Free Solder Assembly
Average Ramp-Up Rate (TL to TP)
3°C /second maximum
3°C /second maximum
Preheat:
-Temperature Min (TSMIN)
-Temperature Max (TSMAX)
-Time (min to max)(tS)
100°C
150°C
60 - 120 s
150°C
200°C
60 - 180 s
TSMAX to TL
- Ramp-Up Rate
3°C /s maximum
Time Maintained Above:
-Temperature (TL)
- Time (tL)
183°C
60 - 150 s
217°C
60 - 150 s
Peak temperature (TP)
225 +0/-5°C
260 +0/-5°C
Time Within 5°C of Actual
Peak Temperature (tP)
10 – 30 s
20 – 40 s
Ramp-Down Rate
6°C /s maximum
6°C /s maximum
Time 25°C to Peak Temperature
6 minutes maximum
8 minutes maximum
Figure 1. Solder Re-Flow Time-Temperature Profile



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