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LM60 数据表(PDF) 6 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
部件名 LM60
功能描述  2.7V, SOT-23 or TO-92 Temperature Sensor
PDF  9 Pages
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制造商  NSC [National Semiconductor (TI)]
网页  http://www.national.com
标志 NSC - National Semiconductor (TI)

LM60 数据表(HTML) 6 Page - National Semiconductor (TI)

  LM60 Datasheet HTML 1Page - National Semiconductor (TI) LM60 Datasheet HTML 2Page - National Semiconductor (TI) LM60 Datasheet HTML 3Page - National Semiconductor (TI) LM60 Datasheet HTML 4Page - National Semiconductor (TI) LM60 Datasheet HTML 5Page - National Semiconductor (TI) LM60 Datasheet HTML 6Page - National Semiconductor (TI) LM60 Datasheet HTML 7Page - National Semiconductor (TI) LM60 Datasheet HTML 8Page - National Semiconductor (TI) LM60 Datasheet HTML 9Page - National Semiconductor (TI)  
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1.0 Mounting (Continued)
2.0 Capacitive Loads
The LM60 handles capacitive loading well. Without any spe-
cial precautions, the LM60 can drive any capacitive load as
shown in
Figure 4. Over the specified temperature range the
LM60 has a maximum output impedance of 800
Ω.Inan
extremely noisy environment it may be necessary to add
some filtering to minimize noise pickup. It is recommended
that 0.1 µF be added from +V
S to GND to bypass the power
supply voltage, as shown in
Figure 5. In a noisy environment
it may be necessary to add a capacitor from the output to
ground. A 1 µF output capacitor with the 800
Ω output imped-
ance will form a 199 Hz lowpass filter. Since the thermal time
constant of the LM60 is much slower than the 6.3 ms time
constant formed by the RC, the overall response time of the
LM60 will not be significantly affected. For much larger ca-
pacitors this additional time lag will increase the overall
response time of the LM60.
SOT-23*
SOT-23**
TO-92*
TO-92***
no heat sink
small heat fin
no heat fin
small heat fin
θ
JA
T
J −TA
θ
JA
T
J −TA
θ
JA
T
J −TA
θ
JA
T
J −TA
(˚C/W)
(˚C)
(˚C/W)
(˚C)
Still air
450
0.17
260
0.1
180
0.07
140
0.05
Moving air
180
0.07
90
0.034
70
0.026
*-Part soldered to 30 gauge wire.
**-Heat sink used is 12" square printed circuit board with 2 oz. foil with part attached as shown in
Figure 2 .
***-Part glued or leads soldered to 1” square of 1/16” printed circuit board with 2 oz. foil or similar.
FIGURE 3. Temperature Rise of LM60 Due to
Self-Heating and Thermal Resistance (
θ
JA)
01268115
FIGURE 4. LM60 No Decoupling Required for
Capacitive Load
01268116
FIGURE 5. LM60 with Filter for Noisy Environment
www.national.com
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