ADA4932-1/ADA4932-2

Data Sheet

Rev. E | Page 26 of 27

LAYOUT, GROUNDING, AND BYPASSING

As a high speed device, the ADA4932-1/ADA4932-2 are

sensitive to the PCB environment in which it operates.

Realizing its superior performance requires attention to the

details of high speed PCB design.

The first requirement is a solid ground plane that covers as much

of the board area around the ADA4932-1/ADA4932-2 as

Pin 3) of all ground and power planes (see Figure 66). Clearing the

ground and power planes minimizes any stray capacitance at

these nodes and thus minimizes peaking of the response of the

amplifier at high frequencies.

the exposed pad, soldered to a high thermal conductivity 4-layer

circuit board, as described in EIA/JESD51-7.

Bypass the power supply pins as close to the device as possible

and directly to a nearby ground plane. Use high frequency ceramic

chip capacitors. It is recommended to use two parallel bypass

capacitors (1000 pF and 0.1 μF) for each supply. Place the 1000

pF capacitor closer to the device. Further away, provide low

frequency bulk bypassing using 10 μF tantalum capacitors from

each supply to ground.

Ensure that signal routing is short and direct to avoid parasitic

effects. Wherever complementary signals exist, provide a

symmetrical layout to maximize balanced performance. When

routing differential signals over a long distance, keep PCB

traces close together, and twist any differential wiring to

minimize loop area. Doing this reduces radiated energy and

makes the circuit less susceptible to interference.

1.30

0.80

0.80

1.30

Figure 67. Recommended PCB Thermal Attach Pad Dimensions (Millimeters)

0.30

PLATED

VIA HOLE

1.30

GROUND PLANE

POWER PLANE

BOTTOM METAL

TOP METAL

Figure 68. Cross-Section of 4-Layer PCB Showing Thermal Via Connection to Buried Ground Plane (Dimensions in Millimeters)