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P9235A-R 数据表(PDF) 17 Page - Integrated Device Technology

部件名 P9235A-R
功能描述  Wireless Power Transmitter
PDF  23 Pages
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制造商  IDT [Integrated Device Technology]
网页  http://www.idt.com
标志 IDT - Integrated Device Technology

P9235A-R 数据表(HTML) 17 Page - Integrated Device Technology

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P9235A-R Datasheet
© 2016 Integrated Device Technology, Inc
17
May 17, 2016
Transmitter Resonant Tank Capacitors
For optimum performance, and to keep the characteristics of the resonant tank constant, the resonant frequency and quality factor must not
change due to variations in the associated capacitors or inductors. The capacitors of the resonant tank (C15, C17, C23, C25) must be
COG/NPO type only. COG/NPO capacitors have no temperature variation, less voltage related de-rating, and better accuracy than other
types of capacitors such at the X7R. Do not mix capacitor types when populating the resonant capacitors, use COG/NPO types only. All the
resonant capacitors must be rated for 50V. See the Bill of Materials for the recommended values.
Transmitter Resonant Tank Coils
Each half-bridge output connects to a series-resonance LC tank. The inductor serves as the primary coil of a loosely-coupled transformer; the
secondary is the receiver coil connected to the P9027LP-R.
The transmitter coils are mounted on a ferrite base acting as a shield to concentrate the field on the top side of the coil and to reduce EMI.
The coil assembly can be mounted next to the P9235A-R PCB or on the back of PCB. Either a ground plane or grounded metal shielding
(preferably copper) can be added beneath the ferrite shield for added reduction in radiated electrical field emissions. The coil ground
plane/shield must be connected to the ground plane by a single trace leading back independently to the board input power connector.
For optimum performance, the following coils are recommended for use with the P9235A-R transmitter for 1, 2 and 3 W applications. The
recommended coil vendors have been tested and verified to guarantee their performance.
Table 11. Coils Recommended with receiver for 1, 2 and 3 W Applications
Output
Power
Vendor
Part number
Inductance
DCR
Dimension
1W
TDK
WT151512-22F2-ID
6.49 uH
0.17 Ω
Ø15 mm
SunLord
SWA15T15H20C01B
6.30 uH
0.12 Ω
Ø15 mm
2W
TDK
WT202012-15F2-ID
6.20 uH
0.10 Ω
Ø20 mm
Wurth Electronics
760308101104
6.30 uH
0.11 Ω
Ø20 mm
SunLord
SWA20N20H20C01B
6.30 uH
0.15 Ω
Ø20 mm
3W
TDK
WT303012-13F2-ID
6.30 uH
0.12 Ω
Ø30 mm
Wurth Electronics
760308101103
6.50 uH
0.15 Ω
Ø30 mm
SunLord
SWA30N30H20C01B
6.25 uH
0.14 Ω
Ø30 mm
PCB Layout Considerations
Layout and PCB design have a significant influence on the system performance. The power dissipation capabilities of the P9235A-R surface
mount packaged power management IC rely heavily on thermally conductive traces and pads to transfer heat away from the package. The
regulator or full bridge inverter could show instability, as well as cause EMI problems, if the PCB layout is not designed properly. The following
general guidelines will be helpful in designing a board layout for low noise and EMI, as well as, the lowest thermal resistance:
1. PC board traces with large cross-sectional areas remove more heat. For optimal results, use large-area PCB patterns with wide
copper traces, placed on the component side of the PCB.
2. In cases where maximum heat dissipation is required, use double-sided copper planes connected with multiple vias.
3. Thermal vias provide a thermal path from the bridge FETs to inner and/or bottom layers of the PCB to remove the heat
generated by device power dissipation.
For more details, please refer to the application note AN936, “P9235A-R Layout Guidelines” for the layout details.



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