ADRF5020

Data Sheet

Rev. A | Page 10 of 12

APPLICATIONS INFORMATION

EVALUATION BOARD

Figure 18 and Figure 19 show the top and cross sectional views

of the evaluation board, which uses 4-layer construction with a

copper thickness of 0.5 oz (0.7 mil) and dielectric materials

between each copper layer.

1500mil

40mil

40mil

EDGE PLATING 5 × 520mil

570mil

R 32mil

Figure 18. Evaluation Board Layout (Top View)

0.5oz Cu (0.7mil)

0.5oz Cu (0.7mil)

0.5oz Cu (0.7mil)

0.5oz Cu (0.7mil)

0.5oz Cu (0.7mil)

RO4003

FR4

FR4

0.5oz Cu (0.7mil)

W = 14mil

G = 5mil

T = 0.7mil

H = 8mil

Figure 19. Evaluation Board (Cross Sectional View)

All RF and dc traces are routed on the top copper layer whereas

the inner and bottom layers are grounded planes that provide a

solid ground for the RF transmission lines. Top dielectric

material is 8 mil Rogers RO4003, offering good high frequency

performance. The middle and bottom dielectric materials are

FR-4 type materials to achieve an overall board thickness of 62 mil.

The RF transmission lines were designed using a coplanar

waveguide (CPWG) model with a width of 14 mil and ground

spacing of 5 mil to have a characteristic impedance of 50 Ω. For

good RF and thermal grounding, as many plated through vias

as possible are arranged around transmission lines and under

the exposed pad of the package.

Figure 20 shows the actual ADRF5020 evaluation board with

component placement. Two power supply ports are connected

to the VDD and VSS test points, TP5 and TP2, and the ground

reference is connected to the GND test point, TP1. On each

supply trace, a 100 pF bypass capacitor is used, and unpopulated

components positions are available for applying extra bypass

capacitors.

Figure 20. Populated Evaluation Board

Two control ports are connected to the EN and CTRL test

points, TP3 and TP4. On each control trace, a resistor position

is available to improve the isolation between the RF and control

signals. The RF ports are connected to the RFC, RF1, and RF2

connectors (J1, J2, and J3) that are end launch 2.4 mm RF

connectors. A through transmission line that connects

unpopulated RF connectors (J7 and J8) is also available to

measure the loss of the PCB. Figure 21 and Table 5 are the

evaluation board schematic and bill of materials, respectively.

The evaluation board shown in Figure 20 is available from

Analog Devices, Inc., upon request.