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ZSC31015EIG1-R 数据表(PDF) 47 Page - Integrated Device Technology

部件名 ZSC31015EIG1-R
功能描述  Analog Output Sensor Signal Conditioner with Diagnostic Features
PDF  52 Pages
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制造商  IDT [Integrated Device Technology]
网页  http://www.idt.com
标志 IDT - Integrated Device Technology

ZSC31015EIG1-R 数据表(HTML) 47 Page - Integrated Device Technology

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© 2016 Integrated Device Technology, Inc
47
November 14, 2016
ZSC31015 Datasheet
1
2
3
4
8
7
6
5
Bsink
VBP
ExtTemp
VBN
VSS
Sig
TM
VDD
Vgate
6
Pin Configuration and Package
The standard package of the ZSC31015 is an SOP-8 (3.81 mm / 150 mil body) with a lead-pitch 1.27 mm / 50 mil.
Table 6.1
Storage and Soldering Conditions for SOP-8 Package
Parameter
Symbol
Conditions
Min
Typical
Max
Units
Maximum Storage Temperature
Tmax_storage
Less than 10hrs, before mounting
150
C
Minimum Storage Temperature:
Tmin_storage
Store in original packing only
-50
C
Maximum Dry-Bake Temperature
Tdrybake
Less than100 hrs total, before
mounting
125
C
Soldering Peak Temperature
Tpeak
Less than 30s
(IPC/JEDEC-STD-020 Standard)
260
C
Figure 6.1
ZSC31015 Pin-Out Diagram
Table 6.2
ZSC31015 Pin Configuration
Pin No.
Name
Description
1
Bsink
Optional ground connection for bridge ground; used for power savings
2
VBP
Positive bridge connection
3
ExtTemp
External diode connection
4
VBN
Negative bridge connection
5
Vgate
Gate control for external JFET regulation/over-voltage protection
6
VDD
Supply voltage (2.7 to 5.5 V)
7
Sig™
ZACwire™ interface (analog out, digital out, calibration interface)
8
VSS
Ground supply



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