Unless otherwise noted, V

Ω. Typical values and limits

appearing in normal type apply for T

range for operation, −40˚C to +85˚C. (Note 7)

Symbol

Parameter

Conditions

Typical

Limit

Units

Min

Max

V

OUT

Output Swing

R

Ω

0.5

V

3.1

I

S

Supply Current

V

0.5

1.4

mA

SR

Slew Rate

0.7

V/µs

GBW

Gain-Bandwidth Product

0.6

MHz

Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device

is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical

Characteristics tables.

Note 2: All voltages are with respect to the potential at the GND pin.

Note 3: The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formula

P= (T

θ

(1)

be dissipated safely at ambient temperatures below 70˚C. Less power can be dissipated safely at ambient temperatures above 70˚C. The Absolute Maximum power

dissipation can be increased by 32.5 mW for each degree below 70˚C, and it must be derated by 32.5 mW for each degree above 70˚C.

Note 4: The human-body model is used. The human-body model is 100 pF discharged through 1.5 k

Ω.

Note 5: This figure is taken from a thermal modeling result. The test board is a 4 layer FR-4 board measuring 101mm x 101mm x 1.6mm with a3x3 array of thermal

vias. The ground plane on the board is 50mm x 50mm. Ambient temperature in simulation is 22˚C, still air. Power dissipation is 1W.

Note 6: Like the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature. The 1.78W rating

(1) above. More power can be dissipated at ambient temperatures below 70˚C. Less power can be dissipated at ambient temperatures above 70˚C. The maximum

power dissipation for operation can be increased by 32.5 mW for each degree below 70˚C, and it must be derated by 32.5 mW for each degree above 70˚C.

Note 7: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100%

production tested or guaranteed through statistical analysis. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality

Control (SQC) methods.

Note 9: Dropout voltage is the input-to-output voltage difference at which the output voltage is 100 mV below its nominal value. This specification does not apply

in cases it implies operation with an input voltage below the 2.5V minimum appearing under Operating Ratings. For example, this specification does not apply for

devices having 1.5V outputs because the specification would imply operation with an input voltage at or about 1.5V.

Note 10: Pulsing the load of LDO X from 100µA to Imax and measuring its effects at the output of LDO Y. LDO Y enabled but under no load.

Note 11: The error flags are internal to the chip. There is no external access to the signals. LDO1 error flag and the LDO2 error flag will go HIGH when the respective

its error flag going LOW. Same delays apply to LDO2 and its error flag.

Note 13: Refer to Timing Diagram.

Note 14: The delay between LDO2 error flag HIGH and RST signal HIGH in the power up sequence. In the power down sequence, it is the delay between RST

signal LOW and LDO2 disabled.

Note 15: The delay between LDO1 error flag HIGH and LDO2 enable in power up sequence. In the power down sequence, it is the delay between LDO2 error flag

LOW and LDO1 disable. For the optional LDO delay, please contact the factory for availability.

Note 16: Time between RST high and PS_HOLD going high.

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