LP3982 datasheet(3/12 Pages) NSC

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Electrical Characteristics (Continued)

Note 1: Absolute Maximum ratings indicate limits beyond which damage may occur. Electrical specifications do not apply when operating the device outside of its

rated operating conditions.

Note 2: All voltages are with respect to the potential at the ground pin.

Note 3: Maximum Power dissipation for the device is calculated using the following equations:

where TJ(MAX) is the maximum junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. E.g. for the MSOP-8

package

θJA = 223˚C/W, TJ(MAX) = 150˚C and using TA = 25˚C, the maximum power dissipation is found to be 561mW. The derating factor (−1/θJA) = −4.5mW/˚C,

thus below 25˚C the power dissipation figure can be increased by 4.5mW per degree, and similarity decreased by this factor for temperatures above 25˚C. The value

of the

θJA for the LLP package is specifically dependent on the PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal

resistance and power dissipation for the LLP package, refer to Application Note AN-1187.

Note 4: Typical Values represent the most likely parametric norm.

Note 5: All limits are guaranteed by testing or statistical analysis.

Note 6: Human body model: 1.5k

Ω in series with 100pF.

Note 7: Condition does not apply to input voltages below 2.5V since this is the minimum input operating voltage.

Note 8: Dropout voltage is measured by reducing VIN until VO drops 100mV from its nominal value at VIN -VO = 0.5V. Dropout Voltage does not apply to the 1.8

version.

Note 9: The SET pin is not externally connected for the fixed versions.

Note 10: The FAULT detection voltage is specified for the input to output voltage differential at which the FAULT pin goes active low.

Functional Block Diagram

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