Copyright © 2015 Future Technology Devices International Limited

31

FT234XD USB TO BASIC UART IC

Version 1.2

Document No.: FT_000753 Clearance No.: FTDI#324

9 Package Parameters

The FT234XD is available in a DFN-12 package. The solder reflow profile is described in Section 9.2.

9.1 DFN-12 Package Mechanical Dimensions

Figure 9.1 DFN-12 Package Dimensions

The FT234XD is supplied in a RoHS compliant leadless DFN-12 package. The package is lead (Pb) free,

and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.

This package is nominally 3.00mm x 3.00mm. The solder pads are on a 0.45mm pitch. The above

mechanical drawing shows the DFN-12 package. Refer to the WDFN column in Figure 9.13.

All

dimensions are in millimetres.

The centre pad on the base of the FT234XD is internally connected to ground.