Copyright © Future Technology Devices International Limited

35

FT51A Advanced MCU with 8051 Compatible Core IC Datasheet

Version 1.5

Doc ument N o.: FT _000877

C learance N o.: FT DI#420

8 Contact Information

Head Office – Glasgow, UK

Branch Office – Tigard, Oregon, USA

Future Technology Devices International Limited

Unit 1, 2 Seaward Place, Centurion Business Park

Glasgow G41 1HH

United Kingdom

Tel: +44 (0) 141 429 2777

Fax: +44 (0) 141 429 2758

Future Technology Devices International Limited (USA)

7130 SW Fir Loop

Tigard, OR 97223-8160

USA

Tel: +1 (503) 547 0988

Fax: +1 (503) 547 0987

E-mail (Sales)

sales1@ftdichip.com

E-mail (Sales)

us.sales@ftdichip.com

E-mail (Support)

support1@ftdichip.com

E-mail (Support)

us.support@ftdichip.com

E-mail (General Enquiries)

admin1@ftdichip.com

E-mail (General Enquiries)

us.admin@ftdichip.com

Branch Office – Taipei, Taiwan

Branch Office – Shanghai, China

Future Technology Devices International Limited (Taiwan)

2F, No. 516, Sec. 1, NeiHu Road

Taipei 114

Taiwan , R.O.C.

Tel: +886 (0) 2 8791 3570

Fax: +886 (0) 2 8791 3576

Future Technology Devices International Limited (China)

Room 1103, No. 666 West Huaihai Road,

Shanghai, 200052

China

Tel: +86 21 62351596

Fax: +86 21 62351595

E-mail (Sales)

tw.sales1@ftdichip.com

E-mail (Sales)

cn.sales@ftdichip.com

E-mail (Support)

tw.support1@ftdichip.com

E-mail (Support)

cn.support@ftdichip.com

E-mail (General Enquiries)

tw.admin1@ftdichip.com

E-mail (General Enquiries)

cn.admin@ftdichip.com

Web Site

http://ftdichip.com

Distributor and Sales Representatives

Please visit the Sales Network page of the

FTDI Web site for the contact details of our distributor(s) and sales

representative(s) in your country.

Sys tem and equipment manufacturers and des igners are responsible to ens ure that their s ystems, and any Future T echnology Devic es

I nternational Ltd (FTDI) devices incorporated in their s ystems, meet all applic able s afety, regulatory and s ys tem-level performanc e

requirements. A ll application-related information in this doc ument (inc luding application descriptions, s uggested FTDI devices and other

materials ) is provided for referenc e only. While FT DI has taken c are to as s ure it is ac c urate, this information is s ubjec t to c us tomer

c onfirmation, and FT DI disclaims all liability for s ys tem des igns and for any applic ations as s is tanc e provided by FT DI . U s e o f FT DI

devic es in life s upport and/or s afety applic ations is e ntirely at the us er’s ris k, and the us er agrees to defend, indemnify and hold

harmles s FTDI from any and all damages , c laims, s uits or expense resulting from s uc h us e. T his document is s ubject to c hange without

notic e. N o freedom to us e patents or other intellectual property rights is implied by the public ation of this doc ument. N either the whole

nor any part of the information c ontained in, or the produc t des cribed in this document, may be adapted or reproduc ed in any material

or elec tronic form without the prior written c ons ent of the c opyright holder. Future T ec hnology Devic es I nternational Ltd, U nit 1 , 2

Seaward P lac e, C enturion Business P ark, Glas gow G4 1 1 H H , U nited Kingdom. Sc otland Regis tered C ompany N umber: SC 1 3 6 6 4 0