STA333IS datasheet(39/43 Pages) STMICROELECTRONICS

部件名	STA333IS

功能描述	100 dB SNR and dynamic range

PDF	43 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

39 / 43 page

DocID022855 Rev 3

39/43

STA333IS

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

The STA333IS comes in a CSP 5x6 array package.

Soldering information

Figure 12. Recommended soldering reflow profile for mounting on PCB

Table 47. Recommended soldering reflow values for mounting on PCB

Profile

Typ.

Max.

Temp. gradient in preheat (T = 70 - 180 °C)

0.9 °C/s

3 °C/s

Temp. gradient (T = 200 - 225 °C)

2 °C/s

3 °C/s

Peak temp. in reflow

240 - 245 °C

260 °C

Time above 220 °C

60 s

90 s

Temp. gradient in cooling

-2 to -3 °C

-6 °C

Time from 50 to 220 °C

160 to 220 s

STA333IS 数据表(PDF) 39 Page - STMicroelectronics