 |
数据搜索系统，热门电子元器件搜索 |
|
|
数据搜索系统，热门电子元器件搜索 |
|
LPS225HB 数据表(PDF) 21 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
LPS225HB 数据表(HTML) 21 Page - STMicroelectronics |
|
|
21 / 47 page  DocID030115 Rev 2 21/47 LPS225HB Application hints 47 5 Application hints Figure 12. LPS225HB electrical connections The device core is supplied through the VDD line. Power supply decoupling capacitors (100 nF, 4.7 μF) should be placed as near as possible to the supply pad of the device (common design practice). The functionality of the device and the measured data outputs are selectable and accessible through the I²C/SPI interface. When using the I²C, CS must be tied high (i.e. connected to VDD_IO). 5.1 Soldering information The HLGA package is compliant with the ECOPACK® standard and it is qualified for soldering heat resistance according to JEDEC J-STD-020. |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Chinese ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
