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STTH3BCF060 数据表(PDF) 4 Page - STMicroelectronics

部件名 STTH3BCF060
功能描述  suitable for PFC up to 400 W
PDF  8 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STTH3BCF060 数据表(HTML) 4 Page - STMicroelectronics

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Characteristics
STTH3BCF060
4/8
Doc ID 17524 Rev 2
Figure 7.
Softness factor versus d
IF/dt
(typical values)
Figure 8.
Relative variations of dynamic
parameters versus junction
temperature
Figure 9.
Transient peak forward voltage
versus dIF/dt (typical values)
Figure 10.
Forward recovery time versus dIF/dt
(typical values)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0
50
100
150
200
250
300
350
400
450
500
S factor
I=I
T =125°C
F
F(AV)
j
V =400V
R
dI /dt(A/µs)
F
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
25
50
75
100
125
IRM
QRR
S factor
T (°C)
j
I=I
Reference: T =125°C
F
F(AV)
j
V =400V
R
0
2
4
6
8
10
12
14
16
18
20
0
20
40
60
80
100
120
140
160
180
200
V
(V)
FP
dI /dt(A/µs)
F
I=I
T =125°C
F
F(AV)
j
0
20
40
60
80
100
120
140
160
180
200
0
20
40
60
80
100
120
140
160
180
200
t (ns)
fr
I=I
T =125°C
F
F(AV)
j
V
=1.1 x V max.
FR
F
dI /dt(A/µs)
F
Figure 11.
Junction capacitance versus
reverse voltage applied
(typical values)
Figure 12.
Thermal resistance junction to
ambient versus copper surface
under lead
1
10
100
1
10
100
1000
C(pF)
V (V)
R
F=1MHz
V
=30mV
T =25°C
OSC
RMS
j
0
10
20
30
40
50
60
70
80
90
100
110
0.00.5
1.0
1.5
2.0
2.53.03.5
4.0
4.55.0
S
(cm²)
CU
R
(°C/W)
th(j-a)
Epoxy printed circuit board, FR4
copper thickness = 35 µm



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