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STL7N60M2 数据表(PDF) 3 Page - STMicroelectronics |
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STL7N60M2 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 13 page ![]() STL7N60M2 Electrical ratings DocID027417 Rev 1 3/13 1 Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VGS Gate-source voltage ± 25 V ID Drain current (continuous) at TC = 25 °C 5 A ID Drain current (continuous) at TC = 100 °C 3.2 A IDM (1) Drain current (pulsed) 20 A ID (2) Drain current (continuous) at Tpcb = 25 °C 1.2 A ID (2) Drain current (continuous) at Tpcb = 100 °C 0.8 A IDM (1)(2) Drain current (pulsed) 4.8 A PTOT Total dissipation at TC = 25 °C 67 W PTOT (2) Total dissipation at Tpcb = 25 °C 4 W dv/dt (3) Peak diode recovery voltage slope 15 V/ns dv/dt (4) MOSFET dv/dt ruggedness 50 V/ns Tstg Storage temperature - 55 to 150 °C Tj Max. operating junction temperature 150 °C Notes: (1) Pulse width limited by safe operating area. (2) When mounted on FR-4 Board of 1 inch², 2 oz Cu (t < 10 s) (3) ISD ≤ 5 A, di/dt ≤ 400 A/µs; VDS peak < V(BR)DSS, VDD = 400 V. (4) VDS ≤ 480 V Table 3: Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case max 0.83 °C/W Rthj-pcb Thermal resistance junction-pcb max 31.3 °C/W Table 4: Avalanche characteristics Symbol Parameter Value Unit IAR Avalanche current, repetitive or not repetitive (pulse width limited by Tjmax) 1 A EAS Single pulse avalanche energy (starting Tj = 25 °C, ID = IAR; VDD = 50 V) 80 mJ |
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