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STBC03 数据表(PDF) 31 Page - STMicroelectronics |
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STBC03 数据表(HTML) 31 Page - STMicroelectronics |
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31 / 34 page ![]() STBC03 Package information DocID029927 Rev 2 31/34 Table 11: Flip Chip 30 (2.59x2.25 mm) package mechanical data Dim. mm Min. Typ. Max. A 0.50 0.55 0.60 A1 0.17 0.20 0.23 A2 0.33 0.35 0.37 b 0.23 0.26 0.29 D 2.56 2.59 2.62 D1 2 E 2.22 2.25 2.28 E1 1.6 e 0.40 SE 0.20 SD 0.20 fD 0.285 0.295 0.305 fE 0.315 0.325 0.335 ccc 0.075 The terminal A1 on the bumps side is identified by a distinguishing feature (for instance by a circular "clear area", typically 0.1 mm diameter) and/or a missing bump. The terminal A1 on the backside of the product is identified by a distinguishing feature (for instance by a circular "clear area", typically between 0.1 and 0.5 mm diameter, depending on the die size). Figure 24: Flip Chip 30 (2.59x2.25 mm) recommended footprint |
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