ESE

SEMICONDUCTOR CORPORATION

VITESSE

SEMICONDUCTOR CORPORATION

Preliminary Data Sheet

VSC7212

Gigabit Interconnect Chip

Page 32

G52268-0, Rev 3.3

04/10/01

© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012

Tel: (800)-VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com

Internet: www.vitesse.com

Package Thermal Considerations

The VSC7212 is packaged in a 100-pin, 14x14x1.0mm, cavity-down, thermally-enhanced TQFP. This

package uses an industry-standard EIAJ footprint but has been enhanced to improve thermal dissipation. The

construction of the package is shown in Figure 23.

Figure 23: TQFP Package Cross Section

Table 17: Thermal Resistance

case temperature specification is not violated. With the thermal resistances shown above, the 14mm thermally-

ambient air temperature exceeds these limits then some form of cooling through a heatsink or an increase in

airflow must be provided.

Moisture Sensitivity Level

This device is rated at a Moisture Sensitivity Level 3 rating with maximum floor life of 168 hours at 30ºC,

60% relative humidity. Please refer to Application Note AN-20 for appropriate handling procedures.

Symbol

Description

TQFP

Units

θ

ca

Thermal resistance from case to ambient in still air including conduction

through the leads.

39.9

θ

ca-100

Thermal resistance from case to ambient with 100 LFM airflow

37.1

θ

ca-200

Thermal resistance from case to ambient with 200 LFM airflow

35.3

θ

ca-400

Thermal resistance from case to ambient with 400 LFM airflow

33.5

θ

ca-600

Thermal resistance from case to ambient with 600 LFM airflow

31.7

Internal Heat Spreader

Die

Plastic Molding Compound

Lead

Bond Wire

Insulator