LQFP100 datasheet(45/116 Pages) STMICROELECTRONICS

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SPC560B40x/50x, SPC560C40x/50x

Package pinouts and signal descriptions

115

3.14.2

Power considerations

The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using

Equation 1:

Equation 1TJ = TA + (PD x RJA)

Where:

TA is the ambient temperature in °C.

RJA is the package junction-to-ambient thermal resistance, in °C/W.

PD is the sum of PINT and PI/O (PD = PINT + PI/O).

PINT is the product of IDD and VDD, expressed in watts. This is the chip internal

power.

PI/O represents the power dissipation on input and output pins; user determined.

RJC

Thermal resistance, junction-to-

case(5)

Single-layer board - 1s

°C/W

100

144

Four-layer board - 2s2p

100

144



Junction-to-board thermal

characterization parameter, natural

convection

Single-layer board - 1s

TBD

°C/W

100

144

Four-layer board - 2s2p

TBD

100

144



Junction-to-case thermal

characterization parameter, natural

convection

Single-layer board - 1s

TBD

°C/W

100

144

Four-layer board - 2s2p

TBD

100

144

Thermal characteristics are based on simulation.

VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C

Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets

JEDEC specification for this package.

Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification for

the specified package.

Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is

used for the case temperature. Reported value includes the thermal resistance of the interface layer.

Table 15. LQFP thermal characteristics(1) (continued)

Symbol

Parameter

Conditions(2)

Pin count

Value

Unit

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