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STM32F732ICK6 数据表(PDF) 5 Page - STMicroelectronics |
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STM32F732ICK6 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 122 page ![]() DocID028480 Rev 1 5/122 STM32F732xx STM32F733xx Contents 5 5.5 UFBGA144 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111 5.6 UFBGA 176+25, 10 x 10, 0.65 mm ultra thin-pitch ball grid array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113 5.7 WLCSP100 - 0.4 mm pitch wafer level chip scale package information .115 5.8 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .118 6 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 Appendix A Recommendations when using internal reset OFF . . . . . . . . . . . 120 A.1 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 |
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