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STA333SML 数据表(PDF) 13 Page - STMicroelectronics |
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STA333SML 数据表(HTML) 13 Page - STMicroelectronics |
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13 / 17 page ![]() DocID025317 Rev 2 13/17 STA333SML Package mechanical data 17 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. The STA333SML comes in a CSP 5x6 array package. Figure 10 below shows the package outline and gives the dimensions. Figure 10. CSP 5x6 array outline drawing 7224730_I |
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