STOD13AM datasheet(16/25 Pages) STMICROELECTRONICS

16 / 25 page

Application information

STOD13AM

16/25

Doc ID 023747 Rev 1

7.2

Recommended PCB layout

The STOD13AM is a high frequency power switching device and therefore requires a proper

PCB layout in order to obtain the necessary stability and optimize line/load regulation and

output voltage ripple.

Analog input (VINA) and power input (VINP) must be kept separated and connected together

at the CIN pad only. The input capacitor must be as close as possible to the IC.

In order to minimize the ground noise, a common ground node for power ground and a

different one for analog ground must be used. In the recommended layout, the AGND node

is placed close to CREF ground while the PGND node is centered at CIN ground. They are

connected by a separated layer routing on the bottom through vias.

The exposed pad is connected to AGND through vias.

Figure 12.

Top layer and silk-screen (top view, not to scale)

Figure 13.

Bottom layer and silk-screen (top view, not to scale)

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