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STTH30R04G 数据表(PDF) 4 Page - STMicroelectronics |
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STTH30R04G 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 10 page ![]() Characteristics STTH30R04 4/10 Figure 7. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, eCU = 35 µm) Figure 8. Relative variations of dynamic parameters versus junction temperature 0 10 20 30 40 50 60 70 80 0 2 4 6 8 10 12 14 16 18 20 Rth (j a)(°C/W) D²PAK SCU(cm²) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 50 75 100 125 150 I RM Q RR I F= 30 A V R=320 V Tj(°C) Q [T ]/Q [T = 125° C] and I RR j RR j RM j RM j [T ]/I [T = 125° C] Figure 9. Transient peak forward voltage versus dIF/dt (typical values) Figure 10. Forward recovery time versus dIF/dt (typical values) Figure 11. Junction capacitance versus reverse voltage applied (typical values) 0 1 1 2 2 3 3 4 4 5 5 0 50 100 150 200 250 300 350 400 450 500 V Fp(V) I F=30 A T j=125 °C dIF/dt(A/µs) 0 200 400 600 800 1000 1200 1400 1600 1800 2000 0 100 200 300 400 500 t FR(ns) I F=30 A V FR=1.1 x VF max. T j=125°C dIF/dt(A/µs) 10 100 1000 1 10 100 1000 C(pF) F=1MHz V OSC=30mVRMS T j=25°C VR(V) |
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