SMM4FxxA

Characteristics

DocID14250 Rev 4

5/12

Figure 9: Thermal resistance junction to ambient

versus copper surface under each lead

= 35 μm)

Figure 10: Leakage current versus junction

temperature (typical values)

40

60

80

100

120

140

160

180

200

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

R th(j-a) (°C/W)

S

(cm²)

CU

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

25

50

75

100

125

150

175

V

V

V

T (°C)

j

I (nA)

R