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TS882 数据表(PDF) 20 Page - STMicroelectronics |
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TS882 数据表(HTML) 20 Page - STMicroelectronics |
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20 / 26 page ![]() Package information TS882, TS884 20/26 DocID024119 Rev 3 4.3 SO14 package information Figure 38. SO14 package outline Table 9. SO14 package mechanical data Dimensions(1) 1. Drawing dimensions include “Single” and “Matrix” versions. Symbol Millimeters Inches Note Min. Typ. Max. Min. Typ. Max. A 1.35 1.75 0.05 0.068 A1 0.10 0.25 0.004 0.009 A2 1.10 1.65 0.04 0.06 B 0.33 0.51 0.01 0.02 C 0.19 0.25 0.007 0.009 D 8.55 8.75 0.33 0.34 (2) 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per side. E 3.80 4.0 0.15 0.15 e 1.27 0.05 H 5.80 6.20 0.22 0.24 L 0.40 1.27 0.015 0.05 k 0° 8° 0° 8° ddd 0.10 0.004 |
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