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SW4459 数据表(PDF) 1 Page - Xian Semipower Electronic Technology Co., Ltd.

部件名 SW4459
功能描述  P-channel Enhanced mode SOP-8 MOSFET
PDF  6 Pages
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制造商  SEMIPOWER [Xian Semipower Electronic Technology Co., Ltd.]
网页  http://www.samwinsemi.com
标志 SEMIPOWER - Xian Semipower Electronic Technology Co., Ltd.

SW4459 数据表(HTML) 1 Page - Xian Semipower Electronic Technology Co., Ltd.

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Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.
Jun. 2016. Rev. 2.0
1/6
SW4459
63oC/W on a 1 in2 pad of 2oz copper.
P-channel Enhanced mode SOP-8 MOSFET
Absolute maximum ratings
Symbol
Parameter
Value
Unit
V
DSS
Drain to source voltage
-30
V
I
D
Continuous drain current (@T
C=25
oC)
-6.5*
A
Continuous drain current (@T
C=100
oC)
-4.1*
A
I
DM
Drain current pulsed
(note 1)
-26
A
V
GS
Gate to source voltage
± 20
V
dv/dt
Peak diode recovery dv/dt
(note 3)
5
V/ns
P
D
Total power dissipation (@T
C=25
oC)
1.98
W
Derating factor above 25oC
0.02
W/oC
T
STG, TJ
Operating junction temperature & storage temperature
-55 ~ + 150
oC
T
L
Maximum lead temperature for soldering
purpose, 1/8 from case for 5 seconds.
300
oC
Thermal characteristics
Symbol
Parameter
Value
Unit
R
thja
Thermal resistance, Junction to ambient(note)
63
oC/W
*. Drain current is limited by junction temperature.
BV
DSS : -30V
I
D
: -6.5A
R
DS(ON) : 37mΩ @VGS=-10V
54m
Ω @V
GS=-4.5V
SOP-8
G
D
S
Order Codes
Item
Sales Type
Marking
Package
Packaging
1
SW K 4459
SW4459
SOP-8
REEL
Features
 High ruggedness
 Low R
DS(ON) (Typ 37mΩ)@VGS=-10V
Low R
DS(ON) (Typ 54mΩ)@VGS=-4.5V
 Low Gate Charge (Typ 12.5nC)
 Improved dv/dt Capability
 100% Avalanche Tested
 Application: DC-DC Converter,
Motor Control
General Description
This power MOSFET is produced with advanced technology of SAMWIN.
This technology enable the power MOSFET to have better characteristics, including
Fast switching time, low on resistance, low gate charge and especially excellent
Avalanche characteristics.
D
D
D
D
G
S
S
S
Note: R
thja is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is d
efined as the solder mounting surface of the drain pins. R
thjc is guaranteed by design while Rthca is determined by the user's
board design.


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