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USBUF 数据表(PDF) 11 Page - STMicroelectronics |
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USBUF 数据表(HTML) 11 Page - STMicroelectronics |
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11 / 13 page ![]() DocID7041 Rev 8 11/13 USBUF Packaging information 13 Table 5. Mechanical specifications Lead Description Lead plating Tin-lead Lead plating thickness 5 m min 25 m max Lead material Sn / Pb (70% to 90%Sn) Lead coplanarity 10 m max Body material Molded epoxy Flammability UL94V-0 |
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