ASL59D4 datasheet(14/15 Pages) ASB

14 / 15 page

14/15

ASB Inc.

 sales@asb.co.kr

June 2017

ASL59D4

6. Package Outline (TSSOP24)

7. Surface Mount Recommendation (In mm)

Symbols

Dimensions (In mm)

MIN

NOM

MAX

---

1.15

0.00

----

0.10

0.80

1.00

1.05

0.19

---

0.30

0.09

---

0.20

7.70

7.80

7.90

4.086

4.286

4.486

6.20

6.40

6.60

4.30

4.40

4.50

2.55

2.75

2.95

---

0.65

---

0.45

0.60

0.75

---

0.10





---



L1-L1

---

0.12

1.00REF

NOTE

1. Add as much copper as possible to inner and outer

layers near the part to ensure optimal thermal

performance.

2. To ensure reliable operation, device ground

paddle-to-ground pad soldering is critical.

Recommended is that thermal grease should be

used for better thermal performance.

3. Add mounting screws near the part to fasten the

board to a heat sinker. Ensure that the ground &

thermal via region contacts the heat sinker.

4. A proper heat dissipation path underneath the area

of the PCB for the mounted device is strictly

required for proper thermal operation. Damage to

the device can result from inappropriate heat

dissipation.

Lot No.

Part No.

2.20

1.00

3.42

1.55

0.34

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