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IXGH28N30 数据表(PDF) 1 Page - IXYS Corporation |
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IXGH28N30 数据表(HTML) 1 Page - IXYS Corporation |
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1 / 2 page ![]() 1 - 2 © 2000 IXYS All rights reserved C (TAB) G = Gate, C = Collector, E = Emitter, TAB = Collector G C E TO-247 AD Features • International standard packages JEDEC TO-268 surface and JEDEC TO-247 AD • High current handling capability • Newest generation HDMOSTM process • MOS Gate turn-on - drive simplicity Applications • AC motor speed control • DC servo and robot drives • DC choppers • Uninterruptible power supplies (UPS) • Switched-mode and resonant-mode power supplies Advantages • High power density • Suitable for surface mounting • Switching speed for high frequency applications • Easy to mount with 1 screw, (isolated mounting screw hole) 97528A (9/98) Symbol Test Conditions Characteristic Values (T J = 25°C, unless otherwise specified) min. typ. max. BV CES I C = 250 mA, V GE = 0 V 300 V V GE(th) I C = 250 mA, V CE = VGE 2.5 5 V I CES V CE = 0.8 • V CES T J = 25°C 200 mA V GE = 0 V T J = 125°C1 mA I GES V CE = 0 V, V GE = ±20 V ±100 nA V CE(sat) I C = I C90, VGE = 15 V 1.6 1.8 V HiPerFASTTM IGBT Symbol Test Conditions Maximum Ratings V CES T J = 25 °C to 150°C 300 V V CGR T J = 25 °C to 150°C; R GE = 1 MW 300 V V GES Continuous ±20 V V GEM Transient ±30 V I C25 T C = 25 °C56 A I C90 T C = 90 °C28 A I CM T C = 25 °C, 1 ms 112 A SSOA V GE= 15 V, TVJ = 125°C, RG = 10 W I CM = 56 A (RBSOA) Clamped inductive load, L = 100 mH @ 0.8 V CES P C T C = 25 °C 150 W T J -55 ... +150 °C T JM 150 °C T stg -55 ... +150 °C Maximum Lead temperature for soldering 300 °C 1.6 mm (0.062 in.) from case for 10 s Maximum Tab temperature for soldering SMD devices for 10 s 260 °C M d Mounting torque (M3) 1.13/10 Nm/lb.in. Weight TO-247 AD 6 g TO-268 4 g V CES = 300 V I C25 =56 A V CE(sat)typ = 1.6 V t fi(typ) = 180 ns Preliminary data IXGH 28N30 IXGT 28N30 TO-268 (IXGT) (TAB) G E IXYS reserves the right to change limits, test conditions, and dimensions. |
类似零件编号 - IXGH28N30 |
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类似说明 - IXGH28N30 |
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